FLEX / RIGID FLEX PRINTED CIRCUIT PRODUCT CAPABILITIES |
Description |
Capabilities |
Line / Space |
Minimum Line / Space |
25 μm / 25 μm (1 mil / 1 mil) |
Vias |
Mechanical Min. Drill Size |
100 μm (4 mil) |
Laser Min. Drill Size |
50 μm (2 mil) |
Product Thickness |
Base Material (Thickness) |
12.5 μm (0.5 mil) - 75 μm (3 mil) |
2 Layers 3 Layers 4 Layers |
< 80 μm
< 140 μm
< 160 μm |
Substrate |
Base Material (Type) |
Polyimide / PET / PEN /
Liquid Crystal Polymer (LCP) / Prepreg / FR4 |
Adhesive (Thickness) |
12.5 μm (0.5 mil) - 50 μm (2 mil) |
Adhesive (Type) |
Acrylic, Epoxy , Prepreg |
Copper Foil (Thickness) |
0.25 oz (9 um) - 2 oz (70 μm) |
Copper Foil (Type) |
Rolled Annealed (RA), Electro Deposited (ED)
High Temperature Elongation (HTE)
High Ductility Copper (HA) |
Stiffener |
Material |
Polymide, FR4, Aluminium, Stainless Steel |
EMI |
EMI Shielding |
Silver Epoxy Coating, Silver Foil Lamination |
Component Assembly |
Passive Component
QFP, BGA, μBGA
BTB
|
≥ 01005
≥ 0.35 mm pitch
Connector pitch ≥ 0.25 mm pitch
|
Plating & Finishing |
OSP (Organic Surface Preservative), ENIG (Electroless Nickel Immersion Gold)
Electrolytic Hard Gold, Tin / Cu Plating, Electrolytic Soft Gold Plating
Electroless Soft Nickel Gold Plating, Electrolytic Nickel Palladium Soft Gold
|
No. of Layers |
Prototype |
Mass Production |
Turnaround (Days) |
FPC |
Single Side |
3 |
7 |
Double Side |
5 |
12 |
Multilayer |
8 |
15 |
RFPC |
Multilayer |
8 |
18 |