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Capabilities


FLEX / RIGID FLEX PRINTED CIRCUIT PRODUCT CAPABILITIES
Description Capabilities
Line / Space Minimum Line / Space 25 μm / 25 μm (1 mil / 1 mil)
Vias Mechanical Min. Drill Size 100 μm (4 mil)
Laser Min. Drill Size 50 μm (2 mil)
Product Thickness Base Material (Thickness) 12.5 μm (0.5 mil) - 75 μm (3 mil)
2 Layers
3 Layers
4 Layers
< 80 μm
< 140 μm
< 160 μm
Substrate Base Material (Type) Polyimide / PET / PEN /
Liquid Crystal Polymer (LCP) / Prepreg / FR4
Adhesive (Thickness) 12.5 μm (0.5 mil) - 50 μm (2 mil)
Adhesive (Type) Acrylic, Epoxy , Prepreg
Copper Foil (Thickness) 0.25 oz (9 um) - 2 oz (70 μm)
Copper Foil (Type) Rolled Annealed (RA), Electro Deposited (ED)
High Temperature Elongation (HTE)
High Ductility Copper (HA)
Stiffener Material Polymide, FR4, Aluminium, Stainless Steel
EMI EMI Shielding Silver Epoxy Coating, Silver Foil Lamination
Component Assembly Passive Component
QFP, BGA, μBGA
BTB
≥ 01005
≥ 0.35 mm pitch
Connector pitch ≥ 0.25 mm pitch
Plating & Finishing OSP (Organic Surface Preservative), ENIG (Electroless Nickel Immersion Gold)
Electrolytic Hard Gold, Tin / Cu Plating, Electrolytic Soft Gold Plating
Electroless Soft Nickel Gold Plating, Electrolytic Nickel Palladium Soft Gold
No. of Layers Prototype Mass Production
Turnaround (Days) FPC Single Side 3 7
Double Side 5 12
Multilayer 8 15
RFPC Multilayer 8 18

PRINTED CIRCUIT BOARD PRODUCT CAPABILITIES
Description Capabilities
Line / Space Minimum Line Width and Space 90 μm / 90 μm (3.5 mil / 3.5 mil)
Vias Minimum Drill Hole Size 200 μm (8 mil)
PTH Hole Aspect Ratio 1:10
Resin Plugging Buried & Blind Via Hole
Via In Pad Technology Thermal Hole Design
Product Range Double Sided to 32 layers
Planar Transformer PCBs
Heavy Copper PCBs Copper up to 10 oz
Metal Based PCBs Copper up to 10 oz
Thin PCB 0.25 mm for Double Side
0.35 mm for 4 layers
Surface Finishing Immersion Nickel/Gold (ENIG) Hot-air leveled Lead Free Solder Coat
Electrolytic Hard Gold Organic Solder Preservative (OSP)
Gold Finger Plating Carbon Contact Printing
Plating Edge
Board Thickness Finish Board Thickness 0.25 mm - 6.0 mm
Material Normal FR4 Halogen Free FR4
CEM3 Aluminium
Component Assembly BGA ≥ 0.35 mm pitch Connector pitch ≥ 0.25 mm pitch
No. of Layers Prototype Mass Production
Turnaround (Days) PCB Double Side 6 14
Multilayer 8 18


Manufacturing Facilities