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Technology Strengths

FPC

  • HDI features with fine pitch circuitry (50µm pitch)

  • Unique dimple mating, with high reliability corrosion resistant for pressure contact (interconnection technology)

  • Integrated various design and thickness heater flex, plastic and metal on flexible printed circuit

  • Technology and strategies on assembling various type of component

  • Capabilities on Anisotropic Conductive Paste (ACP) & ACF (Anisotropic Conductive Film) bonding (CMOS, FOG, FOF, FOB)

 
Flying Lead FPC

  • Double Side

  • 5.12 mil line / 4.72 mil space

  • Hard Gold @ ZIF / Tin @ flying lead

  • Double Side

  • 5 mil line / 4 mil space

  • Hard Gold @ ZIF / Tin @ flying lead

  • Multi Layer (3 layers)

  • 2 mil line / 2 mil space

  • Soft Gold @ flying lead / Soft ENIG @ component area & exposed area

  • Blind via

  • Double Side

  • 2.36 mil line / 2.36 mil space

  • Hard Gold @ ZIF / Tin @ flying lead

FPC with Dimple

  • Double Side, Single Side

  • Electrolytic Nickel & Hard Gold Plating

  • Dimple height max 0.05mm

FPC with Heater

  • Double Side

  • 4 mil line / space

  • ENIG

FPC with Metal

  • Single Side

  • ENIG / Bare Copper

  • Double Side

  • 3 mil line / space

  • Soft Gold

FPC with Plastic

  • Single Side

  • ENIG / Tin / Bare Copper

Type of Conductive Bonding

CMOS
  • Camera Module bonding on Flex

FOG
  • Flex bonding on Glass

FOB
  • Flex bonding on Board

FOF
  • Flex bonding on Flex

Various Type of Component Assembly

We offer a one stop turnkey assembly service which include :

  • Switches

  • Mic

  • Camera socket

  • LED

  • Microphone

  • Filter

  • Diode

  • Varistor

  • Thermistor

  • Receiver

  • Sensor

  • Beeper

  • Transformer

  • Resistor

  • Capacitor

  • Heater

  • Speaker

  • Relay

  • FET (Field Effect Transistor)

  • Phototransistor

  • Jumper

  • Proximity Sensor – IC

  • Hall switch sensor – IC

  • EEPROM – IC

  • Triac

 

PCB

  • Heavy copper PCB up to 10oz copper and up to 32 layers

  • Embedded copper coin technology for heat dissipation, thermal simulation & reliability

  • 2.5D cavity to enhance PCB thermal management, reduce overall thickness of an assembled device by recessing “thick” component

 
Heavy Copper PCB

FPC with Plastic

  • 10oz copper thickness

  • up to 24 layers

  • Inner Layer with blind via

Heavy Copper PCB

  • up to 32 layers

  • Depth control drilling & milling

  • Impedance control ±10%

Embedded Copper Coin PCB

  • Embedded I Coin

  • ENIG Finishing

  • Coin Inner Flatness Control <30um