1 January 2015
GL Cheng as MFS Chief Innovation Officer
With MFS’s vision and strategic business direction to become Innovative Partner-of-Choice for Printed Circuit Applications (PCBs, FPCs, Rigid-Flex), the company has created a position for Chief Innovation Officer (CIO) to support the initiative.
Effective 1 January 2015, Mr. GL Cheng is our Chief Innovation Officer. He is responsible for exploring new technologies to develop into new products, overseeing research projects, and providing reliable technical assessments of potential mergers and acquisitions.